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APX9270
Direct PWM Variable Speed Fan Motor Driver Features
* * * * * * *
Single Phase Full Wave Fan Driver Low Quiescent Current (6mA Typical) Built-in Variable Speed Function Current Limit Circuit (includes both internal and external Current Limit) Built-in Lock Protection and Auto Restart Function FG (rotation speed detection) Output Soft Switching Circuit (before phase change, enabling low-consumption, low loss and low noise drive.) Over Voltage Protection (16.5V Typical) Built-in Kickback Absorption Circuit Built-in Thermal Protection Circuit Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APX9270 is a single phase, DC brushless motor driver with PWM variable speed control and current limit features suitable for the fan of personal computer' power s supply and CPU cooler. The PWM control system includes thermistor input signal and direct PWM input signal, enabling highly silent and low vibration speed control. The device is equipped with a built-in lock protection, which protects the fan when it is locked. It also has rotation speed detection output and thermal protection function. The APX9270 is available in SSOP-20 and TSSOP-20P packages (see Pin Configurations).
* * * *
Applications
* *
CPU Coolers Variable Speed Control Fans
Ordering and Marking Information
APX9270 Assembly Material Handling Code Temperature Range Package Code
APX9270 XXXXX
Package Code N : SSOP-20 R: TSSOP-20P Operating Ambient Temperature Range I : -40 to 90 oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device XXXXX - Date Code
APX9270 N/R :
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
Pin Configurations
PGND 1 OUT2 2 VM 3 VCC 4 OSCH 5 OSCL 6 SET 7 MIN 8 PWM 9 OSC10 SSOP-20 20 PGND 19 PGND 18 OUT1 17 SGND 16 6VREG 15 CT 14 IN 13 HB 12 IN + 11 FG PGND 1 OUT2 2 VM 3 VCC 4 OSCH 5 OSCL 6 SET 7 MIN 8 PWM 9 OSC10 TSSOP-20P 20 PGND 19 PGND 18 OUT1 17 SGND 16 6VREG 15 CT 14 IN 13 HB 12 IN + 11 FG
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 1 www.anpec.com.tw
APX9270
Absolute Maximum Ratings
Symbol VCC VM IOUT VOUT1/VOUT2 VPGND IHB VSET VMIN VPWM VFG IFG VOSC VCT PD TJ TSTG TSDR Parameter VCC Pin Supply Voltage (VCC to SGND) VM Pin Supply Voltage (VM to SGND) OUT1/OUT2 Pin Maximum Output Current OUT1/OUT2 Pin Output Voltage (OUT1, OUT2 to SGND) PGND to SGND Voltage HB Pin Output Current SET Pin Input Voltage (SET to SGND) MIN Pin Input Voltage (MIN to SGND) PWM Pin Input Voltage (PWM to SGND) FG Pin Output Voltage (FG to SGND) FG Pin Output Current OSC Pin Input Voltage (OSC to SGND) CT Pin Input Voltage (CT to SGND) Power Dissipation SSOP-20 TSSOP-20P Maximum Junction Temperature Storage Temperature Range Maximum Lead Soldering Temperature, 10 Seconds 1.2 1.5 150 -55 to 150 260 C C C W Ratings -0.3 to 18 -0.3 to VCC 1.2 VPGND-0.3 to VM -0.3 to 0.3 0 to 15 -0.3 to 7 -0.3 to 7 -0.3 to VCC -0.3 to VCC 0 to 10 -0.3 to 7 -0.3 to 7 Unit V V A V V mA V V V V mA V V
Note 1: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device.
Thermal Characteristics
Symbol RTH,JA Parameter Thermal Resistance-Junction to Ambient SSOP-20 TSSOP-20P
Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy).
Value 104 83
Unit X C/W
Recommended Operating Conditions
Symbol VCC VM VSET VMIN VPWM VOSCH/VOSCL VICM TA VCC Pin Supply Voltage VM Pin Supply Voltage SET Pin Input Voltage Range MIN Pin Input Voltage Range PWM Pin Input Voltage Range OSC High/Low Level Input Voltage Range Hall Input Common Phase Input Voltage Range Ambient Temperature Parameter Rating 4.5 to 15 3.5 to 15 0 to 6 0 to 6 0 to VCC 0 to 6 0.2 to 3 -40 to 90 Unit V V V V V V V C
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APX9270
Electrical Characteristics
Symbol SUPPLY CURRENT V6VREG VHB ICC1 ICC2 OSCILLATOR IOSC1 IOSC2 OSC Charge Current OSC Discharge Current 7.5 7.5 10 10 12.5 12.5 A A V V A A 6VREG Pin Output Voltage HB Pin Output Voltage Operating Current I6VREG = 5mA IHB = 5mA Rotation Mode Lock Protection Mode 5.85 1.2 6 1.3 6 6 6.15 1.4 8 8 V V mA mA Parameter
(VCC = 12V, TA = 25C, RL= 0, unless otherwise specified)
APX9270 Min. Typ. Max.
Test Conditions
Unit
LOCK PROTECTION VCTH VCTL ICT1 ICT2 RCT VOL VOH VFG IFGL CT Pin High Level Voltage CT Pin Low Level Voltage CT Charge Current CT Discharge Current CT Charge/Discharge Current Ratio CCT = 1F CCT = 1F VCT = 0V VCT = 3.6V RCT = ICT1/ICT2 IOUT = 400mA IOUT = 400mA IFG = 5mA VFG = 7V Zero to peak including offset and hysteresis 3.4 1.4 1.65 0.165 8 3.6 1.6 2.2 0.22 10 3.8 1.8 2.75 0.275 12
OUTPUT DRIVERS Output Lower Side Saturation Output Upper Side Saturation FG Pin Low Voltage FG Pin Leak Current 0.2 0.4 0.2 0.1 0.3 0.6 0.4 1 V V V A
HALL SENSITIVITY VHN Hall Input Sensitivity 25 35 mV
CURRENT-LIMIT ILIM IRL Internal Current-Limit External Current-Limit RL= 0.5 1200 960 mA mA
THERMAL PROTECTION Thermal Protection Temperature Thermal Protection Hysteresis Over-Voltage Protection VOV Over-Voltage Threshold 16.5 V 160 20 C
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APX9270
Typical Operating Characteristics
VCC Supply Current vs. VCC Supply Voltage
7
Rotation Mode
VCC Supply Current vs. VCC Supply Voltage
7
Lock Mode
6 VCC Supply Current (mA) 5 4 3 2 1 0 0 5 10 15 VCC Supply Voltage (V)
VCC Supply Current (mA)
6 5 4 3 2 1 0 0 5 10 15 VCC Supply Voltage (V)
11 OSC Charge/Discharge Current (A)
OSC Charge/Discharge Current vs. VCC Supply Voltage
CT Charge/Discharge Current (A)
3 2.5 2 1.5 1 0.5 0 0
CT Charge/Discharge Current vs. VCC Supply Voltage
Charge Current
10.5 Charge Current 10 Discharge Current 9.5
Discharge Current
9 0 5 10 15 VCC Supply Voltage (V)
5
10
15
VCC Supply Voltage (V)
Output Saturation Voltage vs. Output Current
2000 1800 Output Saturation Voltage (mV) 1400 1200 1000 800 600 400 200 0 0 200 400
Lower Side Saturation Voltage
FG Pin Low Voltage vs. Sink Current
300 250 FG Pin Low Voltage (mV)
1600
Upper Side Saturation Voltage
200 150 100 50 0 0 1 2 3 4 5 6 7 8 9 10 FG Pin Sink Current (mA)
600
800
1000
Output Current (mA)
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APX9270
Typical Operating Characteristics
Maximum Power Dissipation vs. Ambient Temperature
TSSOP-20P
1.6
Maximum Power Dissipation (W)
1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 25
SSOP-20
Ambient Temperature ( C)
50
75
100
125
150
Operating Waveforms
Rotation Waveform 1
VOUT1
Rotation Waveform 2
VCC VOUT1
1, 2 VOUT2
1 2, 3
VIN-
VOUT2
3, 4 VIN+
4
IIN
Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VIN+, 100mV/Div, AC Ch4 : VIN-, 100mV/Div, AC Time : 2ms/Div
Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 500mA/Div, DC Time : 2ms/Div
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APX9270
Operating Waveforms (Cont.)
Rotation Waveform 3
VCC VOUT1 VOUT2
Power ON Waveform
VCC VOUT1
1 2, 3
1 2, 3 VOUT2
4
4 IIN IIN
Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 200mA/Div, DC Time : 2ms/Div
Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 500mA/Div, DC Time : 50ms/Div
Lock Protection Waveform 1
VOUT2
Lock Protection Waveform 2
VOUT2
1, 2
VOUT1
1, 2
VOUT1
3
VCT
3
VCT
4
IIN
4
IIN
Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VCT, 2V/Div, DC Ch4 : IIN, 1A/Div, DC Time : 1s/Div
Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VCT, 2V/Div, DC Ch4 : IIN, 1A/Div, DC Time : 1s/Div
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APX9270
Pin Description
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NAME PGND OUT2 VM VCC OSCH OSCL SET MIN PWM OSC FG IN+ HB INCT 6VREG SGND OUT1 PGND PGND Power Stage GND. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Supply Voltage for Output Stage Input Pin. Supply Voltage Input Pin. Setting of the OSC Waveform High Level Voltage. Use a voltage divider from 6VREG to set OSC waveform high-level voltage. Setting of the OSC Waveform Low Level Voltage. Use a voltage divider from 6VREG to set OSC waveform low-level voltage. Speed Setting. An external voltage into SET pin to set fan speed. Minimum Speed Setting. Use a voltage divider from 6VREG to set MIN pin voltage for setting minimum speed. PWM Signal Input Terminal. Oscillator Frequency Setting. Connect a capacitor to SGND to set oscillation frequency. Rotation Speed Output. This is an open-collector output. Hall Input +. Connect to hell element positive output. Hall Bias. This is a 1.3V constant-voltage output for hall element bias. Hall Input -. Connect to hell element negative output. Shutdown Time and Restart Time Setting. Connect a capacitor to SGND to set shutdown time and restart time in lock mode. 6V Regulator Output. This is a 6V constant-voltage output for application circuit biases. Control Stage GND. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Power Stage GND. Power Stage GND. FUNCTION
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APX9270
Block Diagram
FG
Thermal Protection
VCC VM 6VREG
6V Regulator
External Current Limiter
Level Shift
HB
Hall Bias
Control circuit
Internal Current Limiter Level Shift
OUT 1
HALL
IN+ IN-
M
OUT 2
Charge/discharge circuit Oscillating circuit
SGND
CT
PWM MIN SET
OSCH OSCL
OSC
PGND
Typical Application Circuits
1. With external current limiter
IIN VIN RL Pull High
R1=1 Voltage
CM=4.7F /25V
VCC 6VREG R6 PWM PWM input R7 R2 OSCH R4 R5 R3 OSCL
VM
RFG=10K
FG
OUT1 M OUT2 MIN HB SET IN+ INSGND PGND H OSC
Thermistor
COSC=100pF
CT
CCT=0.47 to 1F
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APX9270
Typical Application Circuits (Cont.)
2. Without external current limiter
IIN VIN R1=2 C1=4.7F/25V VCC 6VREG R6 PWM PWM input R7 R2 OSCH R4 R5 OUT2 MIN HB SET Thermistor
COSC=100pF
Pull High Voltage VM RFG=10K FG
OUT1
R3 OSCL
M
IN+ INSGND PGND
H
OSC CT
CCT=0.47 to 1F
Note 3: In hot plug application, it' necessary to protect against a hot plug input voltage overshoot. Placing a s resistor (R1) in series with a capacitor (C1 or CM) dampens the overshoot.
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APX9270
Function Description
Variable Speed Control
The APX9270 is designed with a variable speed controller which has two external input signals, a temperature signal sensed by a thermistor and an external PWM signal. Temperature Speed Control Using thermistor get temperature to make SET pin voltage. The fan' speed is decided by comparing OSC and s SET pin voltage. In addition, the lowest drive duty is set by comparing the OSC oscillating voltage and MIN pin voltage (only for temperature speed control side). Temperature control system works by comparing the voltage of SET and OSC. When SET voltage is lower than OSC voltage, one OUT pulled high and another OUT pulled low. On the contrary, when SET voltage is higher than OSC voltage, upper side transistors are OFF; meanwhile, the coil current re-circulates lower side transistor. Therefore, with decreasing SET voltage, the output ON-Duty will be increasing, which results in the increasing of the coil current and motor rotation speed. External PWM Speed Control This is a pin for the direct PWM speed control. PWM pin input is pulled down to GND when it is not used. The minimum duty is performed by R6 and R7 resistances (see Typical Application Circuit). R7 is left open if you want to stop rotation when PWM duty is 0%. (see Figure 1: Rotation Control Curve)
OUT-DUTY (%)
the fan is locked. Connecting the capacitor from CT pin to GND determines the shutdown time and restart time. As the fan is locked, the charge/discharge circuit will charge the CT capacitor to 3.6V by a 2.2A source current for a locked detection time, and then the circuit will switch the capacitor to discharge. During the discharging interval, the output drivers are switched off until the CT voltage is discharged to 1.6V by a 0.22A sink current, and the circuit will switch the capacitor to charge. In the charging interval, the IC enters the restart time; one output is high and another is low, which makes a torque for fan rotation until the CT voltage is charged to 3.6V by a 2.2A source current. If the locked condition still remains, the charge/ discharge process will be recurred until the locked condition is released (see Figure 2: Lock/Auto Restart Waveform). VINVIN+ VOUT2 VOUT1 TOFF TOFF TON
VCT VFG Lock Lock Detection Release
External PWM-Duty Duty % 100
Figure 2: Lock/Auto Restart Waveform
Current Limit The APX9270 includes both internal and external current limiters. External current limiter value is programmed by RL which is located between VCC pin and VM pin. The external current limiter works when the voltage difference
Duty 50%
Duty0% TA (oC)
Figure 1: Rotation Control Curve
between both sides of RL raises to be 0.48V or higher. For example, the RL=0.5, the external current limiter value is fixed and internally set at 960mA. The internal current limiter value is different in rotation mode and lock mode. It is 1.2A in rotation mode, but it decreases to 0.6A in lock mode. This feature can reduce power consumption while the fan is locked. In general application, it is
Lockup Protection and Automatic Restart The APX9270 provides the lockup protection and automatic restart functions to prevent the coil burnout while
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APX9270
Function Description (Cont.)
Current Limit (Cont.) recommended to short RL resistance and remove CM capacitor to disable external current limiter because the internal current limiter is sufficient to avoid overload. FG Output The FG pin is an open drain output connecting a pull up resistor to a high level voltage for the speed detection function. When VIN- is larger than VIN+, the VFG is low (switch on); when VIN- is smaller than VIN+, the VFG is high (switch off). Leave it open when not in using. Thermal Protection The APX9270 is designed with a thermal protection to protect the IC from the damage of over temperature. When internal junction temperature reaches 160C, the output devices will be switched off. When the IC' juncs tion temperature cools by 20C, the thermal sensor will turn the output devices on again resulting in a pulsed output during continuous thermal overload.
Truth Table
SET L H PWM L L L L H H Input INH L H L H L H L IN+ L H L H L H L H CT OUT1 H L OFF L OFF L OFF L Output OUT2 L H L OFF L OFF L OFF FG L OFF L OFF L OFF L OFF Mode Rotation (Drive) Rotation (Regeneration) Output Regeneration Mode by External Signal Lock Mode
L
H
SET or PWM=[L], "L" means that SET or PWM voltage is smaller than OSC voltage. Also, SET or PWM=[H], "H" means that SET or PWM voltage is greater than OSC voltage.
Application Information
Input Protection Diode & Capacitor The input protection diode (D1) between supply voltage and VCC pin has to be used to prevent the reverse current flowing into the supply power. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be larger than the maximum output current. For the noise reduction purpose, a capacitor (C1/CM) must be connected between VCC/VM and SGND/PGND. The C1/CM should be placed near the device VCC/VM pin as close as possible. Setting of the Oscillator Frequency and Output Voltage The oscillator is used for PWM speed control. Compare the OSC and SET pin voltages can decide PWM duty and PWM frequency depends on the oscillator frequency. The oscillator is based on internal charge/discharge circuit. The circuit charges COSC to VOSCH by a 10A source current, and then it will discharge C OSC to V OSCL by 10A sink current. The circuit can generate a triangular waveform. The triangular waveform is determinded by COSC, R2, R3, R4, and R4. (see Typical Application Circuit)
VOSCH = V 6 VREG x VOSCL = V 6 VREG x R3 R2 + R3 R5 R 4 + R5
fOSC =
0.5 x ISOC1 ( VOSCH - VOSCL) x COSC
For example: COSC=100pF, R2 = R5 = 10k, R3 = R4 = 20k, IOSC1=10A VOSCH= 4V, VOSCL= 2V, fOSC=25kHz The recommended OSC frequency range is from 22kHz to 32kHz.
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APX9270
Application Information (Cont.)
HB Bias Output and Hall Input Signals The IC outputs a 1.3V voltage on HB pin to provide bias for the external hall element. The IC also has two pins IN+ and IN- to receive the hall signals from the hall element. The hall signals are very weak so the layout tracks must be short and far away from those noise sources to avoid noise coupling. The hall input amplifier has 20mV hysteresis. Therefore, the recommended differential hall input voltage should be more than 60mV. CT Capacitor The capacitor that is connected from CT pin to GND determines the shutdown time and restart time. Locked Detection Time = Restart Time = CCT x (V CT1 - 0.2 V ) ICT1 Thermal Pad Consideration The thermal pad on the bottom of the TSSOP-20P package should be soldered down to a copper pad on the circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper plane is not on the top surface of the circuit board, 8 to 10 vias of 13 mil or smaller in diameter should be used to thermally couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder filled. The copper plane is used to conduct heat away from the thermal pad should be as large as practical. If the ambient temperature is higher than 25C, a larger copper plane or forced-air cooling will be required to keep the APX9270 junction temperature below the thermal protection temperature (160C). Thermal Consideration Refer to "Maximum Power Dissipation vs. Ambient Temperature", the IC is safe to operate below the curve and it will cause the thermal protection if the operating area is above the line. For example, TA= 50C, the SSOP20 package maximum power dissipation is about 0.95W. Power dissipation can be calculated by the following equation:
CCT x (V CT1 - V CT2 ) ICT1 CCT x (V CT1 - V CT2 ) ICT2
Shutdown Time =
where
CCT = CT pin capacitor For example: VCC=12V, CCT=1F Locked Detection Time = 1.545 s Restart Time = 0.909 s Shutdown Time = 9.091 s The value of charge capacitor in the range of 0.47F to 1F is recommended. FG Resistor The value of the FG resistor could be decided by the following equation
PD = VCC - VOUT1 - VOUT2 x IOUT + VCC x ICC
For example: When VCC = 12V, ICC = 6mA, IOUT = 300mA, VOUT1 = 11.66V, VOUT2 = 0.13V, then PD = 0.213W According the power dissipation issue, we could adapt this SSOP-20 package.
(
)
RFG =
V 6VREG - VFG
IFG
For example: V6VREG = 6V, IFG = 5mA, VFG = 0.2V, RFG = 1.16k The value of resistor in the range of 1k to 10k is recommended.
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APX9270
Package Information
SSOP-20
D
SEE VIEW A
E1
E
h X 45
e
b
c
A
0.25
A2
A1
GAUGE PLANE SEATING PLANE VIEW A
0
L
S Y M B O L A A1 A2 b c D E E1 e L h 0
SSOP-20 MILLIMETERS MIN. MAX. 1.75 0.10 1.24 0.20 0.15 8.56 5.80 3.80 0.635 BSC 0.40 0.25 0 1.27 0.50 8 0.016 0.010 0 0.30 0.25 8.76 6.20 4.00 0.25 0.004 0.049 0.008 0.006 0.337 0.228 0.150 0.025 BSC 0.050 0.020 8 0.012 0.010 0.345 0.244 0.157 MIN. INCHES MAX. 0.069 0.010
Note : 1. Follow JEDEC MO-137 AD. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APX9270
Package Information
TSSOP-20P
D SEE VIEW A
D1
EXPOSE D PAD
E2
E1 b A2
e
E
c 0.25 GAUGE PLANE SEATING PLANE VIEW A
0
A1
A
L
S Y M B O L A A1 A2 b c D D1 E E1 E2 e L 0
TSSOP-20P MILLIMETERS MIN. MAX. 1.20 0.05 0.80 0.19 0.09 6.40 2.20 6.40 BSC 4.30 1.50 0.65 BSC 0.45 0 0.75 8 0.018 0 4.50 4.00 0.169 0.059 0.026 BSC 0.030 8 0.15 1.05 0.30 0.20 6.60 5.00 0.002 0.031 0.007 0.004 0.252 0.087 0.252 BSC 0.177 0.157 MIN. INCHES MAX. 0.047 0.006 0.041 0.012 0.008 0.260 0.197
o
o
o
o
Note : 1. Follow JEDEC MO-153 ACT. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APX9270
Carrier Tape & Reel Dimensions
OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B
d
Application
A 330O .00 2
H 50 MIN. P1 8.0O .10 0 H 50 MIN. P1
H A
T1
T1 C 16.4+2.00 13.0+0.50 -0.00 -0.20 P2 2.0O .10 0 D0 1.5+0.10 -0.00
d 1.5 MIN. D1 1.5 MIN.
D
W
W
E1
F 7.5O .1 0 K0
20.2 MIN. 16.0O .30 1.75O .10 0 0 T 0.6+0.00 -0.40 D A0 B0
SSOP-20
P0 4.0O .10 0
6.40O .20 9.00O .20 2.10O .20 0 0 0 W E1 F 7.50O .10 0 K0
Application
A 330.0O .00 2
T1 C d 16.4+2.00 13.0+0.50 -0.00 -0.20 1.5 MIN. P2 D0 1.5+0.10 -0.00 D1
20.2 MIN. 16.0O .30 1.75O .10 0 0 T A0 6.9O .20 0 B0
TSSOP-20P
P0
4.00O .10 8.00O .10 2.00O .10 0 0 0
1.5 MIN. 0.30O .05 0
6.90O .20 1.60O .20 0 0 (mm)
Devices Per Reel
Package Type SSOP-20 TSSOP-20P Unit Tape & Reel Tape & Reel Quantity 2500 2000
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APX9270
Reflow Condition (IR/Convection or VPR Reflow)
TP Ramp-up TL Tsmax tp Critical Zone TL to TP
Temperature
tL
Tsmin Ramp-down ts Preheat
25
t 25C to Peak
Time
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C, 5 sec 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1 tr > 100mA
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds
6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Note: All temperatures refer to topside of the package. Measured on the body surface.
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APX9270
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures 3 Package Thickness Volume mm <350 <2.5 mm 240 +0/-5C 2.5 mm 225 +0/-5C
3
Volume mm 350 225 +0/-5C 225 +0/-5C
Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level.
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jun., 2008
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www.anpec.com.tw

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